High madaidaicin Laser perforation na gilashi da filastik
Siffofin:
1. Ana amfani da Laser mai ƙarfi mai ƙarfi da ƙarfi mai ƙarfi don kawar da kayan da aka dasa kai tsaye, tare da yankin μm-matakin zafi da ya shafa da ƙaramin aiki na 5μm.
2. Ana sarrafa motsi na katako a cikin babban sauri da madaidaicin madaidaici ta madaidaicin galvanometer don gane madaidaicin saurin sauri na ƙaramin tsari.
3. Madaidaicin matsayi da aiki na ƙananan ƙananan ramuka masu mahimmanci an gane su ta hanyar fassarar madaidaicin fassarar fassarar;
4. Z-axis yana daidaitawa ta hanyar lantarki don daidaitaccen mayar da hankali don saduwa da bukatun aiki na kayan aiki tare da kauri daban-daban.
5. Madaidaicin madaidaicin mayar da hankali na kewayon babban kyamarar masana'antu mai mahimmanci yana tabbatar da kwanciyar hankali na tsawon lokaci da daidaito na tsarin.
6. Tsarin yana ɗaukar matakan katako na marmara don inganta ingantaccen tsarin tsarin, kuma duk kayan aikin injiniya an zaɓi su a hankali don tabbatar da daidaito na dogon lokaci.
7. Ana iya amfani da shi don sarrafa karafa, yumbu, Organics, gilashin da sauran kayan don cimma nasara, ramukan makafi, ta ramuka, slotting, yanke, da dai sauransu.
8. Matsakaicin faɗin layin sarrafawa ƙasa da 5μm.
Kewayon aikace-aikace:
Semiconductor m kewaye allo yankan, ITO fim etching, microelectronic na'urar masana'antu, bugu samfur shirye-shiryen, biochip shiri, daidaici micro
Mold kafa
Lura: Yanayin zafin jiki na dindindin (25 ± 0.5 ℃), wanda aka samu bayan preheating na mintuna 30