Ukuchaneka okuphezulu kweLaser yokugqobhoza kweglasi kunye neplastiki
Iimbonakalo:
1. I-laser ye-UV yamandla aphezulu kunye ne-high-stable isetyenziselwa ukutshisa ngokuthe ngqo izinto ezenziwe ngumphunga, kunye nommandla we-μm ochaphazelekayo wokushisa kunye neyona ndawo incinci yokucubungula ye-5μm.
2. Ukutshintshwa kwe-beam kulawulwa ngesantya esiphezulu kunye nokuchaneka okuphezulu nge-galvanometer echanekileyo ukuqonda i-high-speed precision etching yefomathi encinci.
3. Ukubekwa okuchanekileyo kunye nokucutshungulwa kwee-micro-holes ezichanekileyo kufezekiswa ngokuguqulelwa kwenqanaba eliphezulu lokuguqulela;
4. I-axis ye-Z ihlengahlengiswa ngombane ukuze igxininise ngokuchanekileyo ukuhlangabezana neemfuno zokucubungula izinto ezinobunzima obuhlukeneyo.
5. I-high-precision focusing of the rangefinder high-resolution industrial camera iqinisekisa ukuzinza kwexesha elide kunye nokuchaneka kwenkqubo.
6. Inkqubo ithatha i-marble countertops ukuphucula ukuzinza ngokubanzi kwenkqubo, kwaye onke amacandelo omatshini akhethwe ngokucophelela ukuqinisekisa ukuchaneka kwexesha elide.
7. Ingasetyenziselwa ukucubungula isinyithi, i-ceramics, i-organics, iglasi kunye nezinye izinto zokufezekisa i-etching, imingxuma eyimfama, ngokusebenzisa imingxuma, i-slot, ukusika, njl.
8. Ubuncinci bomgca wokucubungula ububanzi bungaphantsi kwe-5μm.
Uluhlu lwesicelo:
I-Semiconductor eguquguqukayo yokusika ibhodi yesekethe, ukufakwa kwefilimu ye-ITO, ukuveliswa kwesixhobo se-microelectronic, ukulungiswa kwetemplate yokushicilela, ukulungiswa kwe-biochip, ukuchaneka kwe-micro
Ukubumba umngundo
Qaphela: Ubushushu obuhlala buhleli (25±0.5℃), bufunyenwe emva kobushushu bemizuzu engama-30