Byuzuye neza Laser perforation kubirahuri na plastiki
Ibiranga:
1. Imbaraga zifite ingufu nyinshi kandi zihamye cyane za UV zikoreshwa muguhindura mu buryo butaziguye ibikoresho byuka, hamwe na μm-urwego rwibasiwe nubushyuhe hamwe nubutaka butunganyirizwa bwa 5μm.
2. Guhinduranya ibiti bigenzurwa ku muvuduko mwinshi kandi bisobanutse neza na galvanometero isobanutse kugirango ibone umuvuduko mwinshi wo gutondeka imiterere nto.
3. Guhitamo neza no gutunganya neza micro-de-verisiyo isobanutse bigerwaho nubusobanuro bwibisobanuro bihanitse;
4. Z-axis irashobora guhindurwa mumashanyarazi kugirango yibande neza kugirango ihuze ibisabwa byo gutunganya ibikoresho bifite ubunini butandukanye.
5. Byibanze cyane byibanda kumurongo wa kamera yinganda zikoresha inganda zituma umutekano uhoraho kandi neza.
6. Sisitemu ifata amabuye ya marble kugirango itezimbere muri rusange sisitemu, kandi ibikoresho byose byubukanishi byatoranijwe neza kugirango harebwe igihe kirekire.
7. Irashobora gukoreshwa mugutunganya ibyuma, ububumbyi, ibinyabuzima, ibirahuri nibindi bikoresho kugirango ugere kubutaka, umwobo uhumye, unyuze mu mwobo, ahantu, gutema, nibindi.
8. Ubugari ntarengwa bwo gutunganya umurongo uri munsi ya 5 mm.
Urwego rusaba:
Semiconductor yoroheje yumuzunguruko wibibaho, gukata firime ya ITO, gukora ibikoresho bya microelectronic, gukora imashini yerekana imashini, gutegura biochip, micro ya precision
Imiterere
Icyitonderwa: Ubushyuhe buhoraho (25 ± 0.5 ℃), bwabonetse nyuma yo gushyushya iminota 30