Ukunemba okuphezulu kwe-Laser perforation yengilazi nepulasitiki

Incazelo emfushane:

Ububanzi bembobo: 1 ~ 30μm,

Izicelo: izitsha, ama-ampoules, izikhwama zokumnika, amabhodlela epulasitiki, njll.

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Izici:

1. I-laser ye-UV enamandla amakhulu futhi ezinzile isetshenziselwa ukushisisa ngokuqondile okokusebenza okuhwamuke, ngendawo ethinteke ekushiseni yeleveli engu-μm kanye nendawo yokucubungula okungenani engu-5μm.

2. Ukushintsha kwe-beam kulawulwa ngesivinini esikhulu kanye nokunemba okuphezulu nge-galvanometer enembile ukuze kubonakale ukufakwa kokunemba kwejubane eliphezulu kwefomethi encane.

3. Ukuma okunembayo nokucutshungulwa kwezimbobo ezincane ezinemba okuphezulu kubonakala ngokuhumusha isigaba sokuhumusha esinembayo esiphezulu;

4. I-axis ye-Z ilungiseka ngogesi ukuze igxile ngokuqondile ukuze ihlangabezane nezidingo zokucubungula izinto ezinobukhulu obuhlukahlukene.

5. Ukugxila okuphezulu kwekhamera yemboni ye-rangefinder enesinqumo esiphezulu kuqinisekisa ukuzinza nokunemba kwesikhathi eside kwesistimu.

6. Uhlelo lwamukela ama-countertops emabula ukuze kuthuthukiswe ukuzinza okuphelele kwesistimu, futhi zonke izingxenye zemishini zikhethwa ngokucophelela ukuze kuqinisekiswe ukunemba kwesikhathi eside.

7. Ingasetshenziselwa ukucubungula izinsimbi, i-ceramics, i-organics, ingilazi nezinye izinto ukuze kuzuzwe i-etching, izimbobo eziyimpumputhe, ngokusebenzisa imigodi, i-slotting, ukusika, njll.

8. Ububanzi obuncane bomugqa wokucubungula bungaphansi kuka-5μm.

Ibanga lesicelo:

I-Semiconductor flexible circuit board cutting, i-ITO film etching, ukukhiqiza idivayisi ye-microelectronic, ukulungiswa kwesifanekiso sokuphrinta, ukulungiswa kwe-biochip, ukunemba okuncane

Ukubumba isikhunta


Izinto	Ipharamitha	I-FM-UVD5	I-FM-UVSD5	I-FM-UPVD12
I-Laser	igagasi	355nm	355nm	355nm
	Amandla	5W@30kHz	5W@30kHz	12W@100kHz
	i-modulating frequency	1 ~ 200kHz	1 ~ 200kHz	1 ~ 2000kHz
	Ububanzi be-Pulse	20ns@30kHz	20ns@30kHz	7ns@100kHz
	ikhwalithi ye-beam	＜1.3	＜1.3	＜1.3
Galvo	Skena indawo	＜50*50mm	＜50*50mm	＜50*50mm
	Ukunemba kokuphindaphinda	＜1 um	＜1 um	＜1 um
	Isivinini sokuskena	≤3m/s	≤3m/s	≤3m/s
	Isivinini sokuma	≤6m/s	≤6m/s	≤6m/s
XY amathebula	Ukuhamba	-	300*300mm	300*300mm
	Ukunemba kokuphindaphinda	-	≤±5um	≤±1um
	Ukumisa ukunemba	-	≤±25um	≤±3um
Z eksisi	Ukuhamba	50mm	50mm	50mm
	Ukunemba kokuphindaphinda	≤±3um	≤±3um	≤±3um
	Ukumisa ukunemba	≤±15um	≤±15um	≤±15um
Ukubekwa kwe-CCD kokuqapha	Ikhamera	ama-megapixel amahlanu	ama-megapixel amahlanu	ama-megapixel amahlanu
Ukubekwa kwe-CCD kokuqapha	Ukukhulisa i-Optical	8X	8X	8X
Iyacubungula	Indawo encane	5 um	5 um	5 um
	Ukunemba kokucubungula imbobo	±5 um	±5 um	±5 um
	Ukunemba kokuphindaphinda	≤±2um	≤±2um	≤±2um
	Izinto ezitholakalayo zokucubungula	Insimbi yengilazi , 有机物等
Isicelo	Ibhodlela lepayipi	ok	kuhle	kuhle
	ibhodlela lokufa	ok	kuhle	kuhle
	Ibhodlela lepulasitiki	akukuhle	ok	kuhle
	Izikhwama ezithambile	Akukho okutholakalayo	ok	kuhle
Isistimu yokupholisa	Isipholile samanzi (umthamo wokupholisa we-1500W)
Ukunikezwa kwamandla kagesi	220V, 50~60HZ, 1 isigaba noma ngokwezifiso
Kala(mm)	150010001800			160013001800
Isisindo(KG)	1500			2000
Ukuqedwa kokulinganisa kwe-Microscopic kwamasampuli asetshenziwe