E phahameng ka nepo Laser perforation bakeng sa khalase le polasetiki
Likaroloana:
1. Laser ea matla e phahameng le e phahameng e tsitsitseng ea UV e sebelisetsoa ho senya ka ho toba thepa e nang le mouoane, e nang le sebaka sa μm-level se amehileng ke mocheso le sebaka se fokolang sa ho sebetsa sa 5μm.
2. Phapang ea maballo e laoloa ka lebelo le phahameng le ho nepahala ho phahameng ke galvanometer e nepahetseng ho lemoha lebelo le nepahetseng ka mokhoa o nepahetseng oa sebopeho se senyenyane.
3. Boemo bo nepahetseng le ts'ebetso ea li-micro-hole tse nepahetseng tse phahameng li lemohuoa ka ho fetolela mokhahlelo o phahameng oa ho fetolela ka nepo;
4. Z-axis e feto-fetoha ka motlakase bakeng sa ho tsepamisa maikutlo ho nepahetseng ho finyella litlhoko tsa ho sebetsana le lisebelisoa tse nang le botenya bo fapaneng.
5. Ho lebisa tlhokomelo e phahameng ka ho fetisisa ea lik'hamera tsa liindasteri tse nang le liqeto tse phahameng li tiisa botsitso ba nako e telele le ho nepahala ha tsamaiso.
6. Tsamaiso e amohela li-countertops tsa marble ho ntlafatsa botsitso ba kakaretso ea tsamaiso, 'me likarolo tsohle tsa mechine li khethoa ka hloko ho netefatsa ho nepahala ha nako e telele.
7. E ka sebelisoa ho sebetsana le tšepe, li-ceramics, organics, khalase le lisebelisoa tse ling ho finyella etching, masoba a foufetseng, ka likoti, slotting, ho itšeha, joalo-joalo.
8. Bophara bo fokolang ba mohala oa ho sebetsa bo ka tlase ho 5μm.
Lethathamo la likopo:
Semiconductor flexible circuit board cutting, ITO film etching, microelectronic device, to printing template, tlhophiso ea biochip, precision micro
Ho etsa hlobo
Tlhokomeliso: Mocheso o sa khaotseng (25±0.5℃), o fumanoe ka mor'a ho futhumatsa pele ka metsotso e 30