Mkulu mwatsatanetsatane Laser perforation kwa galasi ndi pulasitiki
Mawonekedwe:
1. Laser yamphamvu kwambiri komanso yosasunthika ya UV imagwiritsidwa ntchito kutulutsa mwachindunji zinthu za vaporized, ndi malo okhudzidwa ndi kutentha kwa μm komanso malo ocheperako a 5μm.
2. Kusintha kwa mtengo kumayendetsedwa pa liwiro lalitali komanso kulondola kwambiri ndi galvanometer yolondola kuti izindikire kuthamanga kolondola kwambiri kwamtundu waung'ono.
3. Kuyika bwino ndi kukonza mabowo ang'onoang'ono olondola kwambiri amazindikiridwa ndi kumasulira siteji yomasulira kwambiri;
4. Z-axis imasinthidwa ndi magetsi kuti iwonetseke bwino kuti ikwaniritse zofunikira zopangira zinthu zokhala ndi makulidwe osiyanasiyana.
5. Kukhazikika kwapamwamba kwambiri kwa makina opanga makina opanga makina opanga makina opangira makina kumatsimikizira kukhazikika kwa nthawi yayitali komanso kulondola kwadongosolo.
6. Dongosololi limagwiritsa ntchito mapepala a marble kuti apititse patsogolo kukhazikika kwa dongosolo lonse, ndipo zigawo zonse zamakina zimasankhidwa mosamala kuti zitsimikizire kulondola kwa nthawi yayitali.
7. Angagwiritsidwe ntchito pokonza zitsulo, ceramics, organics, galasi ndi zipangizo zina kukwaniritsa etching, mabowo akhungu, kupyolera mabowo, slotting, kudula, etc.
8. The osachepera processing mzere m'lifupi ndi zosakwana 5μm.
Ntchito zosiyanasiyana:
Semiconductor flexible circuit cutting, ITO film etching, microelectronic device, printing template kukonzekera, biochip kukonzekera, precision micro
Kupanga nkhungu
Chidziwitso: Kutentha kosalekeza (25 ± 0.5 ℃), komwe kumapezeka mutatha kutentha kwa mphindi 30