Makina a Micropore Laser Perforation a semiconductor

The osachepera processing micropore awiri ndi 5μm, wonse processing kulondola ndi ± 4μm, m'deralo mbali yolondola ndi zosakwana 3μm, ndi m'lifupi processing ndi 300 * 300mm..

Amagwiritsidwa ntchito makamaka pa: kupanga zida zazing'onoting'ono, kukonza template yosindikiza, kukonzekera kwa biochip, kupanga nkhungu mwatsatanetsatane, kupanga zida mwatsatanetsatane

1. Kugwiritsa ntchito mphamvu yamphamvu komanso yokhazikika ya UV laser kuti iwononge mwachindunji zinthu za gasification, ndi μm-level processing aperture ndi malo okhudzidwa ndi kutentha kwa μm;

2. Kuwongolera kothamanga kwambiri komanso kulondola kwapang'onopang'ono kwamitengo kudzera m'magalasi olondola ochokera kunja kuti akwaniritse liwiro laling'ono laling'ono laling'ono;

3. Kuthamanga kwambiri komanso kulondola kwambiri kwa mawonekedwe ang'onoang'ono-bowo kumadziwika ndi kumasulira kwa nsanja yamtundu wa micron-liwiro;

4. Z-olamulira ndi magetsi chosinthika kuti azolowere zipangizo za makulidwe osiyanasiyana ndi kukwaniritsa zofunika taper dzenje processing;

5. Makamera amtundu wa axis super-resolution industry amagwiritsidwa ntchito pokonza zolakwika zonse za galvanometer, ultra-high-precision focusing, ndi kuyeza kwa intaneti kuti zitsimikizire kukhazikika kwa nthawi yaitali ndi kulondola kwa dongosolo;

6. Dongosololi limagwiritsa ntchito mapepala a miyala ya marble kuti apititse patsogolo kukhazikika kwa dongosolo lonse, ndipo zigawo zonse zamakina zimasankhidwa mosamala kuti zitsimikizire kulondola kwa nthawi yayitali;

7. The osachepera processing micropore awiri ndi 5μm, wonse processing kulondola ndi ± 4μm, m'deralo mbali yolondola ndi zosakwana 3μm, ndi m'lifupi processing ndi 300 * 300mm;

8. Amagwiritsidwa ntchito popanga ma micromachining olondola a zitsulo, zoumba, zowotcha za silicon, magalasi, organics ndi zinthu zina, monga kukonza kabowo kakang'ono ndi kudula mwatsatanetsatane.

Poyerekeza ndi EDM yaying'ono pobowo processing, kubowola makina, dzimbiri mankhwala, nkhonya makina, etc., laser mwatsatanetsatane micro-hole Machining ali ndi ubwino zotsatirazi:

Kuthamanga kwambiri (mpaka mabowo 4000 pa sekondi imodzi)

Zolondola kwambiri (<3μm)

Palibe zoletsa zakuthupi (zitsulo, ceramics, silicon wafers, organics, etc.)

Ndondomeko ya dzenje (osachepera 5μm, dzenje lapadera)

Kugawa akhoza makonda (processing m'lifupi 300mm * 300mm), palibe nkhungu ndi chigoba chofunika

Palibe kuipitsa ndipo palibe consumables

kukonza mwachindunji

Chidziwitso: Kutentha kosalekeza (25 ± 0.5 ℃), komwe kumapezeka mutatha kutentha kwa mphindi 30