Micropore Laser Perforation Machine for semiconductor

Dhexroorka micropore-ka ugu yar waa 5μm, saxnaanta guud ee wax-qabadka waa ± 4μm, saxnaanta muuqaalka maxalliga ah ayaa ka yar 3μm, ballaciisuna waa 300 * 300mm..

Inta badan loo isticmaalo: wax soo saarka qalabka microelectronic, diyaarinta template daabacaadda, diyaarinta biochip, samaynta caaryada saxda ah, saxnaanta qaybaha qalabaynta

1. Isticmaalka awoodda sare iyo xasiloonida sare ee UV laser si toos ah u baabi'iyo walxaha gaaska, oo leh aperture-ka-shaqeynta heerka μm iyo heerka μm-heer kuleylku saameeyay;

2. Xawaaraha sare iyo kantaroolka saxda ah ee saxda ah ee leexinta biimka iyada oo loo marayo galvanometer sax ah oo laga keeno si loo gaaro farsamaynta saxda ah ee qaabka yar yar ee xawaaraha sare;

3. Xawaaraha sare iyo saxnaanta sare ee qaab-dhismeedka qaab-dhismeedka yar-yar ee daloolka waxaa lagu gartaa tarjumaadda mashiinka toosan ee heerka sare ee heerka-yar;

4. dhidibka Z waa koronto la hagaajin karo si uu ula qabsado walxaha dhumucdiisuna kala duwan iyo in la buuxiyo shuruudaha habaysan dalool taper gaar ah;

5. Kaamirada warshadaha ee cabbirka sare ee cabbirka waxaa loo isticmaalaa sixitaanka qaladka buuxa ee galvanometer, diiradda sare-sare ee saxda ah, iyo cabbirka internetka si loo hubiyo xasilloonida muddada dheer iyo saxnaanta nidaamka;

6. Nidaamku wuxuu qaataa muraayadaha marmarka ah si loo hagaajiyo xasilloonida guud ee nidaamka, dhammaan qaybaha farsamada ayaa si taxadar leh loo doortay si loo hubiyo saxnaanta muddada dheer;

7. Dhexdhexaadiyaha micropore-ka ugu yar ee wax-soo-saarka waa 5μm, saxnaanta guud ee wax-qabadka waa ± 4μm, saxnaanta muuqaalka gudaha waa wax ka yar 3μm, iyo ballaca processing waa 300 * 300mm;

8. Waxaa loo isticmaalaa micromachining saxda ah ee biraha, ceramics, wafers silicon, galaas, organics iyo qalab kale, sida farsamaynta dalool yar iyo goynta saxda ah.

Marka la barbar dhigo farsamaynta dalool-yar ee EDM, qodista farsamada, daxalka kiimikada, feerka farsamada, iwm.

Xawaaraha sare (ilaa 4000 dalool ilbiriqsikii)

Saxnimo sare (<3μm)

Ma jiraan wax xaddidaad ah (birta, ceramics, wafers silicon, organics, iwm.)

Hannaanka daloolka la barnaamijka karo (ugu yaraan 5μm, dalool taper gaar ah)

Qaybinta waa la habeyn karaa (ballaadhka habaynta 300mm*300mm), looma baahna caaryo iyo maaskaro

Wax wasaq ah iyo wax la isticmaalo ma jiro

habayn toos ah

Xusuusin: Heerkulka joogtada ah (25 ± 0.5 ℃), oo la helay ka dib kulaylka 30 daqiiqo