Micropore Laser Perforation Machine ye semiconductor

Iyo shoma yekugadzirisa micropore dhayamita ndeye 5μm, iyo yakazara kugadzirisa iko ± 4μm, iyo yemuno chimiro chechokwadi isingasviki 3μm, uye hupamhi hwekugadzirisa i300 * 300mm..

Inonyanya kushandiswa ku: microelectronic device kugadzira, kudhinda template kugadzirira, biochip kugadzirira, kunyatsoita mold kuumba, instrumentation precision zvikamu kugadzira.

1. Kushandisa high-simba uye yakakwirira-kugadzikana UV laser kuti abvise zvakananga gasification zvinhu, ine μm-level processing aperture uye μm-level-inopisa-inopisa nzvimbo;

2. High-speed uye yakakwirira-chaiyo kudzora kwedanda kutsauswa kuburikidza kune kunze kwenyika chaiyo galvanometers kuti iwane yakakwirira-yekukurumidza diki-format chaiyo micro-gomba processing;

3. High-speed uye high-precision yakakura-format micro-hole processing inowanikwa nekushandurwa kwe micron-level high-speed linear motor platform;

4. Iyo Z-axis inogadziriswa nemagetsi kuti ienderane nemidziyo yehukobvu hwakasiyana uye kusangana nechaiyo taper hole kugadzirisa zvinodiwa;

5. Iyo yakawanda axis super-resolution industry kamera inoshandiswa pakugadzirisa-furemu kukanganisa kukanganisa kwegalvanometer, ultra-high-precision focusing, uye chiyero chepaIndaneti kuti ive nechokwadi chekugadzikana kwenguva refu uye kururamisa kwegadziriro;

6. Iyo sisitimu inotora marble countertops kuti ivandudze kugadzikana kwese kwehurongwa, uye ese ma mechanical components anonyatsosarudzwa kuti ave nechokwadi chenguva refu yakarurama;

7. Iyo shoma yekugadzirisa micropore dhayamita ndeye 5μm, iyo yose yekugadzirisa kunyatsoita ndeye ± 4μm, iyo yemunharaunda chimiro chakarurama iri pasi pe3μm, uye hupamhi hwekugadzirisa huri 300 * 300mm;

8. Inoshandiswa kunyatsogadzirisa micromachining yesimbi, ceramics, silicon wafers, girazi, organics nezvimwe zvinhu, zvakadai se micro-hole processing uye kunyatsocheka.

Kuenzaniswa neEDM micro-hole processing, mechanical drilling, chemical corrosion, mechanical punching, etc., laser precision micro-hole machining ine zvinotevera zvakanakira:

High kumhanya (kusvika 4000 maburi pasekondi)

Kurongeka kwepamusoro (<3μm)

Hapana zvinorambidzwa (simbi, ceramics, silicon wafers, organics, nezvimwewo)

Programmable gomba pateni (zvishoma 5μm, chaiyo taper gomba)

Kugovera kunogona kugadzirwa (kugadzirisa hupamhi 300mm * 300mm), hapana mold uye mask inodiwa.

Hapana kusvibiswa uye hapana zvinodyiwa

zvakananga kugadzirisa

Cherechedza: Tembiricha yenguva dzose (25±0.5 ℃), inowanikwa mushure mekupisa kwemaminetsi makumi matatu