Micropore Laser Perforation Machine for semiconductor
The minimum processing micropore diameter is 5μm, the overall processing accuracy is ±4μm, the local feature accuracy is less than 3μm, and the processing width is 300*300mm. .
Mainly used for: microelectronic device manufacturing, printing template preparation, biochip preparation, precision mold forming, instrumentation precision parts manufacturing
1. Using high-power and high-stability UV laser to directly ablate the gasification material, with a μm-level processing aperture and a μm-level heat-affected zone;
2. High-speed and high-precision control of beam deflection through imported precision galvanometers to achieve high-speed small-format precision micro-hole processing;
3. High-speed and high-precision large-format micro-hole processing is realized by the translation of the micron-level high-speed linear motor platform;
4. The Z-axis is electrically adjustable to adapt to materials of different thicknesses and to meet specific taper hole processing requirements;
5. The range axis super-resolution industrial camera is used for full-frame error correction of the galvanometer, ultra-high-precision focusing, and online measurement to ensure the long-term stability and accuracy of the system;
6. The system adopts marble countertops to improve the overall stability of the system, and all mechanical components are carefully selected to ensure long-term accuracy;
7. The minimum processing micropore diameter is 5μm, the overall processing accuracy is ±4μm, the local feature accuracy is less than 3μm, and the processing width is 300*300mm;
8. It is used for precision micromachining of metals, ceramics, silicon wafers, glass, organics and other materials, such as micro-hole processing and precision cutting.
Compared with EDM micro-hole processing, mechanical drilling, chemical corrosion, mechanical punching, etc., laser precision micro-hole machining has the following advantages:
High speed (up to 4000 holes per second)
High precision (<3μm)
No material restrictions (metals, ceramics, silicon wafers, organics, etc.)
Programmable hole pattern (minimum 5μm, specific taper hole)
Distribution can be customized (processing width 300mm*300mm), no mold and mask required
No pollution and no consumables
direct processing
Items | Parameter | FM-UVM3A | FM-UVM3B |
Laser | wave | 355nm | |
Power | >3W@40kHz (3-40W optional) | ||
modulating frequency | 1~200kHz | ||
Pulse width | 15ns@40kHz | ||
beam quality | <1.2 | ||
Galvo | Scan area | <50*50mm | <15*15mm |
Repeatability accuracy | <1um | ||
Positioning accuracy | ≤±3um | ||
X Y tables | Travel | 300*300mm (600*600mm optional) | |
Positioning resolution | 0.1um | ||
Repeatability accuracy | ≤±1um | ||
Positioning accuracy | ≤±3um | ||
Acceleration | ≤1G | ||
Speed | ≤200mm/s | ||
Z axis | Travel | 150mm | |
Repeatability accuracy | ≤±3um | ||
Positioning accuracy | ≤±5um | ||
CCD monitoring positioning |
Camera | five-megapixel | |
Optical magnification | 10X | ||
region splicing | accuracy | ±3μm | |
Processing | Minimum spot | 8um | 5um |
Hole processing accuracy | ±5um | ||
Repeatability accuracy | ≤±1um | ||
Available materials for procesing | Glass, organics, metals, ceramics, etc. | ||
GGGGApplication | Pipe bottle | ok | good |
die bottle | ok | good | |
Plastic bottle | not good | ok | |
Soft bags | No available | ok | |
Coolant system | Water coolant (1500W cooling capacity ) | ||
Power supply | 220V, 50~60HZ, 1 phase or customized | ||
Power | ≤2000W | ||
Measure(mm) | 1200*1200*1900mm | ||
Weight (KG) | 1200Kg |
Note: Constant temperature (25±0.5℃), obtained after preheating for 30 minutes