I-Micropore Laser Perforation Machine ye-semiconductor

Ubuncane be-micropore yokucubungula ubukhulu bungu-5μm, ukunemba kokucubungula sekukonke kungu-±4μm, ukunemba kwesici sendawo kungaphansi kuka-3μm, nobubanzi bokucubungula buyi-300*300mm..

Isetshenziselwa kakhulu: ukukhiqiza idivayisi ye-microelectronic, ukulungiswa kwesifanekiso sokuphrinta, ukulungiswa kwe-biochip, ukwakhiwa kwesikhunta okunembayo, ukukhiqizwa kwezingxenye zokunemba kwezinsimbi

1. Ukusebenzisa i-laser ye-UV enamandla amakhulu futhi ezinzile ukuze kushiswe ngokuqondile okokusebenza kwegesi, ngembobo yokucubungula yeleveli engu-μm kanye nendawo ethinteke ekushiseni yezinga elingu-μm;

2. Ukulawulwa kwesivinini esikhulu nokunemba okuphezulu kokuchezuka kwe-beam ngokusebenzisa ama-galvanometer anembile angenisiwe ukuze kuzuzwe ukucubungula kwe-micro-hole enesivinini esikhulu sefomethi encane;

3. Ukucutshungulwa kwezimbobo ezincane ezinejubane eliphezulu nokunemba okuphezulu kwenziwa ngokuhunyushwa kwepulatifomu yemoto ewumugqa wezinga eliphezulu le-micron;

4. I-Z-eksisi ilungiseka ngogesi ukuze ivumelane nezinto eziwugqinsi futhi ihlangabezane nezidingo ezithile zokucubungula imbobo ye-taper;

5. Ikhamera ye-axis ye-super-resolution yebanga yohlu isetshenziselwa ukulungiswa kwephutha lohlaka olugcwele lwe-galvanometer, ukugxila kwe-ultra-high-precision, kanye nokulinganisa ku-inthanethi ukuze kuqinisekiswe ukuzinza nokunemba kwesikhathi eside kwesistimu;

6. Uhlelo lwamukela ama-countertops emabula ukuze kuthuthukiswe ukuzinza okuphelele kwesistimu, futhi zonke izingxenye zemishini zikhethwa ngokucophelela ukuze kuqinisekiswe ukunemba kwesikhathi eside;

7. I-diameter encane yokucubungula i-micropore ingu-5μm, ukunemba kokucubungula sekukonke kungu-±4μm, ukunemba kwesici sendawo kungaphansi kuka-3μm, nobubanzi bokucubungula buyi-300*300mm;

8. Isetshenziselwa ukunemba kwe-micromachining yezinsimbi, i-ceramics, ama-silicon wafers, ingilazi, i-organics nezinye izinto, njengokucubungula i-micro-hole nokusika ngokunemba.

Uma kuqhathaniswa nokucutshungulwa kwezimbobo ezincane ze-EDM, ukumba ngomshini, ukugqwala kwamakhemikhali, ukubhoboza ngomshini, njll., ukunemba kwe-laser micro-hole machining kunezinzuzo ezilandelayo:

Isivinini esikhulu (kufika ku-4000 izimbobo ngomzuzwana)

Ukunemba okuphezulu (<3μm)

Ayikho imikhawulo yezinto ezibonakalayo (izinsimbi, izitsha zobumba, ama-silicon wafers, izinto eziphilayo, njll.)

Iphethini yembobo ehlelekayo (ubuncane be-5μm, imbobo ye-taper ethize)

Ukusabalalisa kungenziwa ngezifiso (ububanzi bokucubungula 300mm * 300mm), akukho isikhunta kanye nemaski edingekayo

Akukho ukungcola futhi akukho okudlekayo

ukucubungula okuqondile

Qaphela: Izinga lokushisa elihlala njalo (25±0.5℃), elitholwe ngemva kokushisisa kuqala imizuzu engama-30