Micropore Laser Perforation Machine don semiconductor

Matsakaicin diamita na micropore shine 5μm, daidaiton aiki gabaɗaya shine ± 4μm, daidaiton fasalin gida bai wuce 3μm ba, kuma faɗin sarrafawa shine 300 * 300mm..

Yafi amfani da: Microelectronic na'urar masana'antu, bugu samfur shiri, biochip shiri, daidai mold forming, instrumentation daidaici sassa masana'antu

1. Yin amfani da wutar lantarki mai ƙarfi da kwanciyar hankali UV laser kai tsaye don kawar da kayan gasification kai tsaye, tare da ɗigon sarrafa matakin μm da yanki mai zafi na μm;

2. Maɗaukakiyar sauri da madaidaicin iko na jujjuyawar katako ta hanyar shigo da madaidaicin galvanometers don cimma babban saurin ƙaramin tsari na daidaitaccen ƙaramin rami;

3. Maɗaukakiyar sauri da madaidaicin babban tsari na ƙirar micro-rami yana samuwa ta hanyar fassarar ma'auni na madaidaicin madaidaicin madaidaicin tsarin motsi;

4. Z-axis yana daidaitawa ta hanyar lantarki don daidaitawa da kayan kauri daban-daban da kuma saduwa da takamaiman buƙatun sarrafa ramin taper;

5. Ana amfani da kyamarar masana'antu mai mahimmanci na kewayon don cikakken gyara kuskuren firam na galvanometer, mai da hankali sosai-madaidaici, da ma'aunin kan layi don tabbatar da kwanciyar hankali na dogon lokaci da daidaiton tsarin;

6. Tsarin yana ɗaukar matakan katako na marmara don inganta ingantaccen tsarin tsarin, kuma an zaɓi duk kayan aikin injiniya a hankali don tabbatar da daidaito na dogon lokaci;

7. Mafi ƙarancin aiki micropore diamita ne 5μm, da overall aiki daidaito ne ± 4μm, da gida alama daidaito ne kasa da 3μm, da kuma aiki nisa ne 300 * 300mm;

8. Ana amfani da daidaitattun micromachining na karafa, yumbu, siliki wafers, gilashin, Organics da sauran kayan, kamar micro-rami aiki da daidaici yankan.

Idan aka kwatanta da EDM micro-rami aiki, inji hakowa, sinadarai lalata, inji punching, da dai sauransu, Laser daidaici micro-rami machining yana da wadannan abũbuwan amfãni:

Babban gudun (har zuwa ramukan 4000 a sakan daya)

Babban daidaito (<3μm)

Babu hani (karfe, yumbu, siliki, wafers, Organics, da sauransu)

Tsarin rami mai shirye-shirye (mafi ƙarancin 5μm, takamaiman rami taper)

Rarraba za a iya musamman (aiki nisa 300mm * 300mm), babu mold da abin rufe fuska da ake bukata.

Babu gurɓatacce kuma babu kayan amfani

sarrafa kai tsaye

Lura: Yanayin zafin jiki na dindindin (25 ± 0.5 ℃), wanda aka samu bayan preheating na mintuna 30