Micropore Laser Perforation Machine for semiconductor

Ubuncinci bokucubungula ubukhulu be-micropore yi-5μm, ukuchaneka kokucubungula ngokubanzi yi-± 4μm, ukuchaneka kwendawo yendawo ingaphantsi kwe-3μm, kunye nobubanzi bokucubungula yi-300 * 300mm..

Isetyenziselwa ikakhulu: ukwenziwa kwesixhobo se-microelectronic, ukulungiswa kwetemplate yoshicilelo, ukulungiswa kwe-biochip, ukubumba ukubumba okuchanekileyo, ukwenziwa kwezixhobo ezichanekileyo

1. Ukusebenzisa i-laser ye-UV yamandla aphezulu kunye nozinzo oluphezulu ukutshisa ngokuthe ngqo izinto ze-gasification, kunye ne-μm-level processing aperture kunye ne-μm-level-level zone echaphazelekayo ukushisa;

2. Ukulawulwa kwesantya esiphezulu kunye nokuchaneka okuphezulu kokuphambuka kwe-beam ngokusebenzisa i-galvanometers echanekileyo engeniswe kumazwe angaphandle ukufikelela kwi-high-speed-speed small-format precision micro-hole processing;

3. Isantya esiphezulu kunye nokuchaneka okuphezulu kwefomathi enkulu ye-micro-hole processing yenziwa ngokuguqulelwa kwe-micron-level high-speed linear motor platform;

4. I-Z-axis ilungelelaniswa ngombane ukuze ihambelane nemathiriyeli yobunzima obuhlukeneyo kunye nokuhlangabezana neemfuno ezithile zokucwangcisa umngxuma we-taper;

5. Uluhlu lwekhamera ye-industrial axis super-resolution isetyenziselwa ukulungiswa kwempazamo epheleleyo ye-galvanometer, i-ultra-high-precision focusing, kunye nokulinganisa kwe-intanethi ukuqinisekisa ukuzinza kwexesha elide kunye nokuchaneka kwenkqubo;

6. Inkqubo ithatha i-marble countertops ukuphucula ukuzinza ngokubanzi kwenkqubo, kwaye onke amacandelo omatshini akhethwe ngononophelo ukuqinisekisa ukuchaneka kwexesha elide;

7. Ubuncinci bokucutshungulwa kwe-micropore ubukhulu yi-5μm, ukuchaneka kokucubungula ngokubanzi ngu-± 4μm, ukuchaneka kwendawo yendawo ingaphantsi kwe-3μm, kunye nobubanzi bokucubungula yi-300 * 300mm;

8. Isetyenziselwa ukuchaneka kwe-micromachining yesinyithi, i-ceramics, i-silicon wafers, iglasi, i-organics kunye nezinye izinto, ezifana ne-micro-hole processing kunye nokusika ngokuchanekileyo.

Xa kuthelekiswa ne-EDM micro-hole processing, ukugrumba ngoomatshini, ukubola kweekhemikhali, ukubethelwa ngoomatshini, njl. njl., ukuchaneka kwe-laser micro-hole machining kunezi nzuzo zilandelayo:

Isantya esiphezulu (ukuya kwimingxuma engama-4000 ngomzuzwana)

Ukuchaneka okuphezulu (<3μm)

Akukho zithintelo eziphathekayo (isinyithi, iiseramics, ii-silicon wafers, i-organics, njl.

Ipateni yomngxunya ecwangcisekileyo (ubuncinane be-5μm, umngxuma we taper ethile)

Ukuhanjiswa kungenziwa ngokwezifiso (ububanzi bokucubungula 300mm * 300mm), akukho ngundo kunye nemaski efunekayo

Akukho ngcoliseko kwaye akukho zinto zisetyenziswayo

inkqubo ngqo

Qaphela: Ubushushu obuhlala buhleli (25±0.5℃), bufunyenwe emva kobushushu bemizuzu engama-30