Imashini ya Micropore Laser Perforation ya semiconductor

Hafi ya micropore ya diametre ni 5μm, muri rusange gutunganya neza ni ± 4μm, imiterere yibikorwa byaho ntabwo iri munsi ya 3 mm, naho ubugari bwo gutunganya ni 300 * 300mm..

Byakoreshejwe cyane cyane: gukora ibikoresho bya microelectronic, gucapa inyandikorugero yo gutegura, gutegura biochip, gushushanya neza, gukora ibikoresho byuzuye ibikoresho

1. Gukoresha imbaraga nyinshi kandi zihamye cyane UV laser kugirango uhindure neza gazi ya gazi, hamwe na μm yo murwego rwo gutunganya aperture hamwe na μm kurwego rwibasiwe nubushyuhe;

2. Umuvuduko wihuse kandi wihuse wo kugenzura ibiti ukoresheje ibicuruzwa bya galvanometero bitumizwa mu mahanga kugirango ugere ku muvuduko wihuse muto-muto utunganijwe neza;

3. Umuvuduko mwinshi kandi wuzuye-nini-nini-nini-itunganywa rya micro-umwobo bigerwaho nubusobanuro bwa micron-urwego rwihuta rwihuta rwumurongo wa moteri;

4. Z-axis irashobora guhindurwa n amashanyarazi kugirango ihuze nibikoresho byubunini butandukanye kandi byujuje ibisabwa byo gutunganya umwobo;

5. Urwego rwa axis super-resolution kamera yinganda ikoreshwa mugukosora amakosa yuzuye yo gukosora galvanometero, ultra-high-precision yibanze, hamwe no gupima kumurongo kugirango harebwe igihe kirekire kandi gihamye cya sisitemu;

6. Sisitemu ifata amabuye ya marble kugirango atezimbere muri rusange sisitemu, kandi ibikoresho byose bya mashini byatoranijwe neza kugirango harebwe igihe kirekire;

7. Ntarengwa ya micropore yatunganijwe ni 5 mm, muri rusange gutunganya neza ni ± 4μm, imiterere yibikorwa byaho ntibiri munsi ya 3 mm, n'ubugari bwo gutunganya ni 300 * 300mm;

8. Ikoreshwa mugukora neza micromachining yicyuma, ceramika, wafer ya silicon, ikirahure, ibinyabuzima nibindi bikoresho, nko gutunganya micro-umwobo no gukata neza.

Ugereranije na EDM itunganya micro-umwobo, gucukura imashini, kwangirika kwa chimique, gukubita imashini, nibindi, gutunganya micro-mwobo ya laser ifite ibyiza bikurikira:

Umuvuduko mwinshi (kugeza 4000 umwobo ku isegonda)

Ibisobanuro birambuye (<3μm)

Nta mbogamizi zifatika (ibyuma, ububumbyi, wafer ya silicon, ibinyabuzima, nibindi)

Igishushanyo mbonera gishobora (byibuze 5μm, umwobo wihariye)

Ikwirakwizwa rishobora gutegurwa (gutunganya ubugari bwa 300mm * 300mm), nta shusho na mask bisabwa

Nta mwanda kandi nta biribwa

gutunganya mu buryo butaziguye

Icyitonderwa: Ubushyuhe buhoraho (25 ± 0.5 ℃), bwabonetse nyuma yo gushyushya iminota 30